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SECTION 5 MAINTENANCE
Since IGBT gates are insulated from any other conducting region, care should be taken to prevent static build up, which
could possibly damage gate oxides. All IGBT modules are shipped from the factory with conductive foam contacting the
gate and emmiter sense pins.
When mounting IGBT modules on a heatsink, certain precautions should be taken to prevent any damage against a sud-
den torque. If a sudden torque (“onesided tightening”) is applied at only one mounting terminal the ceramic insulation
plate or silicon chip inside the module may get damaged. The mounting screws are to be fastened in the order shown in
Figure 5-1. Also, care must be taken to achieve maximum contact (i.e. minimum contact thermal resistance) for the best
heat dissipation. Application of a thermal pad on the contact surface improves it thermal conductivity. See Replacement
Parts section for the required pad. A torque wrench should be used. Tighten mounting screws to 28 in-lbs (3.2 m-n); wire
connecting screws to 19 in-lbs (2.1 m-n). If torque is too heavy, the device can damage like the above “one-sided tighten-
ing”.
G. IGBT Handling and Replacement (continued)
Figure 5-1 Mounting Screw Installation
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